27890120VM05
SEMiX302GB12E4s-M05
SEMiX 2s, HPTP
27890120VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 117x64x17 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | Homogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532 |
| Gehäuse | SEMiX 2s |
| Herkunftsland | Slovakia |
| Produktlinie | SEMiX |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 300 A |
| Technologie | IGBT |
| Topologie | Half-Bridge |
| Typische Anwendungsgebiete | Motor DrivesPower SupplyMatrix Converter |
| Variante | HPTP |
| Varianten Beschreibung | The SEMiX302GB12E4s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.279 Kilogramm |
| Nettogewicht | 0.24 Kilogramm |