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27922500VM04

SEMiX205BT07F3SC4-M04

SEMiX 5p, HALA P8

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)130x70x17
Chip TechnologieSiC Diode + IGBT 3 (Trench)
EigenschaftenSolderless assembling solution with PressFIT signal pins and screw power terminalsIGBT 3 High Speed Trench TechnologySilicon Carbide (SiC) Free-wheeling Schottky diodes : Diode 1 (D1…D4)Silicon anti-parallel diodes , Diode 2 (D5…D8)V<sub>CE(sat) </sub>with positive temperature coefficientLow inductance caseReliable mechanical design with injection moulded terminals and reliable internal connectionsUL recognized file no. E63532NTC temperature sensor inside
GehäuseSEMiX 5p
HerkunftslandItaly
ProduktlinieSEMiX
ProduktstatusIn Production New
Spannung650 V
Stromstärke (A)200 A
TechnologieHybrid SiC
Topologie3-Level
TypSEMiX 5p
Typische AnwendungsgebieteHigh Frequency Resonant ConverterInterleaved Active RectifierUPS
VarianteHALA P8
Varianten BeschreibungThe SEMiX205BT07F3SC4-M04 is a 650 V Hybrid SiC module and comes with pre-applied phase change material HALA P8 (λ=3.4 W/mK). HALA P8 is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Varianten KurzbeschreibungModule + Phase Change Material HALA P8

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.475 Kilogramm
Nettogewicht0.39 Kilogramm
Proposition 65Cancer and Reproductive Harm