Power Electronics for UPS Systems
The availability of infrastructure systems strongly depends on reliable power supplies, irrespective of whether these systems are servers and cloud storage systems, critical traffic control or hospital services.
Uninterruptable Power Supplies (UPS) ensure continuous operation of these critical systems. In Semikron Danfoss power modules, flexible topologies equipped with the latest IGBT and diode chips ensure maximum conversion efficiency for double conversion UPS systems. This efficiency can be further improved using silicon carbide technology.
High Power Density UPS
with a Classic Power Module
One of the main design targets for UPS systems is power density as installation space is costly. For medium to high power UPS systems, 3-level topologies like TNPC are a quasi standard. The SEMITRANS Classic TNPC fulfills both requirements and is the perfect choice for your medium power UPS system.
Thanks to the integration of the latest Generation 7 IGBTs, the SEMITRANS 3 TNPC increases power density significantly. Two modules form an efficient 3-level topology layout, scalable from 450 to 800A nominal current, allowing 200 to 300kVA output power respectively.
With silicon carbide MOSFET versions of the vertical half-bridge the output power density can be further increased. The pre-applied High Performance Phase Change Material gives it another boost.
Key FeaturesMore about SEMITRANS
Most Comprehensive UPS Portfolio
Highest UPS Power Density with SEMiX 5
With its comprehensive portfolio and its optimized design, the SEMiX 5 power modules are ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. An adapter board for easy gate drive integration is also available.
The internal chip layout is optimized for enhanced thermal performance, reducing operating temperatures and thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.
High power density thanks to comprehensive portfolioMore about SEMiX 5
IGBT and Rectifier Modules
SEMiX® 550kVA up to 500kVA
Extended standard for superior thermal and dynamic performance
MiniSKiiP®20kVA up to 100kVA
Solder-free spring technology for minimum assembly time
SEMIPACK®800V up to 2200V
Bipolar modules from the market leader
SEMITOP® E1/E28kVA up to 100kVA
Exceeding the standard for superior performance
SEMiX® 3 Press-Fit100kVA up to 300kVA
Exceeding the standard for superior performance
SEMITRANS® Classic100kVA up to 600kVA
The proven power electronics packages
SEMITRANS® 10/10+/10 P3L300kVA up to 1MVA
Robust high power modules
SEMITRANS® 20300kVA up to 1MVA
The new standard in high power
Intelligent Power Modules – IPMs
The Most Powerful IPM in the Market
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air or water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.
The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.
To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
Key FeaturesMore about SkiiP
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
The Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.More about Power Electronic Stack
In addition to standard stacks, Semikron Danfoss has vast experience in developing customer-specific solutions. Engineers are available in our stack centers around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your successMore about Customized Stacks
The unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.
Our IGBT drivers are available as two- channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.
Achieve outstanding system compactness and create space- and cost-effective inverter designs with our drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.
More than 25 years of experience in developing innovative IGBT driver electronics enables Semikron Danfoss to have a short-term solution for almost every challenge related to driver electronics. Our Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with the adapter boards or application sample PCBs. For the latter, Semikron Danfoss shares the entire manufacturing data to decrease development time, speeding up the time-to-market.
Our SKYPER and SKHI are well-known, highly robust and reliable IGBT driver solutions under demanding environmental conditions. Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.
Our SKIC ASIC technology enables very compact system design with minimal peripheral components. With highly integrated signal processing and multi-channel failure management, our ASICs offer robust gate control.
Adapter Board and Application Samples
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
Semikron Danfoss was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material (TIM). We now have over two decades of experience and more than 25 million pre-printed modules in the field.
We design print patterns for each module type for the best TIM distribution and thickness when the module is mounted to a heatsink. These patterns are printed on the modules in a clean environment on an automated silkscreen and stencil printing line. Statistical process control (SPC) is used to guarantee consistency. Special packaging is implemented to ensure that the TIM arrives at your production line in pristine condition.
In order to achieve the best thermal performance in all applications, Semikron Danfoss power modules can be supplied with our High Performance Thermal Paste (HPTP).
Alternatively, for ease-of-handling during assembly, most power modules are also available with pre-applied phase change material (PCM). Phase change materials have a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface. With HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material, we combine the benefits of a phase change material with the performance of the best available paste.