Rail Traction Systems
Power Electronics for Traction Applications
Whenever we talk about traction applications, we see extremely high demand for reliability, lifetime and safety. Semikron Danfoss is offering this requirements to our customers since we developed the first isolated power module on the market in 1974. For more than 25 years, our highly reliable SKiiP IPMs are driving light rails, trams and subways all over the world.
With our new SEMITRANS 20 power module family, Semikron Danfoss brings latest sinter and bonding technology to the new high power standard package. Semikron Danfoss also stands for innovative solutions for auxiliary power supplies: our silicon and silicon carbide powered devices, especially the SEMITRANS and SEMITOP module families, allow reliable, efficient and compact systems.
The New High Power Standard in Rail Traction Drives
The SEMITRANS 20 product family increases product lifetime and power output. SEMITRANS 20 modules deliver significant advantages for the traction market:
On top of this, the SEMITRANS 20 Traction module provides Semikron Danfoss innovative technologies such as sintered chips and AlCu wire bonds. Additionally the SEMITRANS 20 Traction features silicon nitride (Si3N4) substrate and AlSiC baseplates to enable a higher isolation voltage of 6kV and lower partial discharge.
Key FeaturesMore about SEMITRANS 20
SiC and Hybrid SiC modules for Auxiliary Power Supplies
The SEMITRANS 3 product family is growing with its new full and hybrid SiC half-bridge modules in 1200V and 1700V. This new portfolio extension allows highly efficient auxiliary power supplies. Due to the high switching frequency of the silicon carbide devices, the size of the passive components can be reduced, and inaudible to the human ear, allowing reduced acoustic insulation.
The decreased losses reduce service and maintenance costs, thanks to passive cooling of the power electronic components. Multiple sourcing down to chip level ensures maximum supply chain safety. Available in 1200V from 350A to 500A and in 1700V from 260A to 400A.
Benefits of SiC Technology in Auxiliary Power SuppliesMore about SEMITRANS 3
IGBT and Rectifier Modules
MiniSKiiP®8kW up to 300kW
Solder-free spring technology for minimum assembly time
SEMITOP® E1/E28kW up to 225kW
Exceeding the standard for superior performance
SEMIPACK®800V up to 2200V
Bipolar modules from the market leader
SEMiX® 3 Press-Fit55kW up to 350kW
Exceeding the standard for superior performance
SEMITRANS® Classic5kW up to 200kW
The proven power electronics package
SEMITRANS® 10/10+200kW up to 1MW
Robust high power modules
SEMITRANS® 20200kW up to 1MW
The new standard in high power
Intelligent Power Modules – IPMs
For Maximum Reliability
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air- or water cooling, also with customized heat sinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.
The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.
To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
High Performance Cooling (HPC) technology has been introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density.More about SKiiP
The unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.
Our IGBT drivers are available as two- channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.
Achieve outstanding system compactness and create space- and cost-effective inverter designs with our drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.
More than 25 years of experience in developing innovative IGBT driver electronics enables Semikron Danfoss to have a short-term solution for almost every challenge related to driver electronics. Our Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with the adapter boards or application sample PCBs. For the latter, Semikron Danfoss shares the entire manufacturing data to decrease development time, speeding up the time-to-market.
Our SKYPER and SKHI are well-known, highly robust and reliable IGBT driver solutions under demanding environmental conditions. Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.
Our SKIC ASIC technology enables very compact system design with minimal peripheral components. With highly integrated signal processing and multi-channel failure management, our ASICs offer robust gate control.
Adapter Board and Application Samples
Thermal Interface Materials (TIM)
Stay Cool - Heat Dissipation is Our Job
Semikron Danfoss was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material (TIM). We now have over two decades of experience and more than 25 million pre-printed modules in the field.
We design print patterns for each module type for the best TIM distribution and thickness when the module is mounted to a heatsink. These patterns are printed on the modules in a clean environment on an automated silkscreen and stencil printing line. Statistical process control (SPC) is used to guarantee consistency. Special packaging is implemented to ensure that the TIM arrives at your production line in pristine condition.
In order to achieve the best thermal performance in all applications, Semikron Danfoss power modules can be supplied with our High Performance Thermal Paste (HPTP).
Alternatively, for ease-of-handling during assembly, most power modules are also available with pre-applied phase change material (PCM). Phase change materials have a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface. With HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material, we combine the benefits of a phase change material with the performance of the best available paste.