Semikron Danfoss logo

25233340M15

SKiiP 39AC12RAV1-M15

MiniSKiiP II 3, Slim lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流150 A
电压1200 V
拓扑Sixpack
产品线MiniSKiiP
外壳MiniSKiiP II 3
尺寸82x59x16
技术IGBT
芯片技术RGA
特性1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
变体Slim lid and HPTP

一般规格

特性
毛重0.1 千克
净重0.082 千克

Variant information

特性
Variants<a href="/products/p/skiip-39ac12rav1-m01-25233340m01">SKiiP 39AC12RAV1-M01</a><a href="/products/p/skiip-39ac12rav1-m05-25233340m05">SKiiP 39AC12RAV1-M05</a><a href="/products/p/skiip-39ac12rav1-m15-25233340m15">SKiiP 39AC12RAV1-M15</a><a href="/products/p/skiip-39ac12rav1-m20-25233340m20">SKiiP 39AC12RAV1-M20</a><a href="/products/p/skiip-39ac12rav1-m25-25233340m25">SKiiP 39AC12RAV1-M25</a>
产品变体介绍The SKiiP 39AC12RAV1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)