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25231740M25

SKiiP 35ACC12F4V1-M25

MiniSKiiP II 3, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地ChinaGermany
电流50 A
电压1200 V
拓扑Twelvepack
产品线MiniSKiiP
外壳MiniSKiiP II 3
尺寸82x59x16
技术IGBT
芯片技术IGBT 4 Fast (Trench)
特性Fast Trench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
变体Standard lid and HPTP

一般规格

特性
毛重0.1 千克
净重0.082 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip-35acc12f4v1-m01-25231740m01">SKiiP 35ACC12F4V1-M01</a><a href="/products/p/skiip-35acc12f4v1-m05-25231740m05">SKiiP 35ACC12F4V1-M05</a><a href="/products/p/skiip-35acc12f4v1-m20-25231740m20">SKiiP 35ACC12F4V1-M20</a><a href="/products/p/skiip-35acc12f4v1-m21-25231740m21">SKiiP 35ACC12F4V1-M21</a><a href="/products/p/skiip-35acc12f4v1-m25-25231740m25">SKiiP 35ACC12F4V1-M25</a>
产品变体介绍The SKiiP 35ACC12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)