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25232830M25

SKiiP 29TMLI12F4V1-M25

MiniSKiiP II 2, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流150 A
电压1200 V
拓扑3-Level
产品线MiniSKiiP
外壳MiniSKiiP II 2
尺寸59x52x16
技术IGBT
芯片技术IGBT 4 Fast (Trench)
特性Fast Trench 4 IGBTsTrench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
变体Standard lid and HPTP

一般规格

特性
毛重0.06 千克
净重0.055 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip-29tmli12f4v1-m00-25232830m00">SKiiP 29TMLI12F4V1-M00</a><a href="/products/p/skiip-29tmli12f4v1-m15-25232830m15">SKiiP 29TMLI12F4V1-M15</a><a href="/products/p/skiip-29tmli12f4v1-m20-25232830m20">SKiiP 29TMLI12F4V1-M20</a><a href="/products/p/skiip-29tmli12f4v1-m21-25232830m21">SKiiP 29TMLI12F4V1-M21</a><a href="/products/p/skiip-29tmli12f4v1-m25-25232830m25">SKiiP 29TMLI12F4V1-M25</a>
产品变体介绍The SKiiP 29TMLI12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)