Semikron Danfoss logo

25232800M25

SKiiP 26MLI07E3V1-M25

MiniSKiiP II 2, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流75 A
电压650 V
拓扑3-Level
产品线MiniSKiiP
外壳MiniSKiiP II 2
尺寸59x52x16
技术IGBT
芯片技术IGBT 3 (Trench)
特性650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
典型应用Uninterruptible power supplies (UPS)Solar inverters
变体Standard lid and HPTP

一般规格

特性
毛重0.06 千克
净重0.055 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip-26mli07e3v1-m00-25232800m00">SKiiP 26MLI07E3V1-M00</a><a href="/products/p/skiip-26mli07e3v1-m01-25232800m01">SKiiP 26MLI07E3V1-M01</a><a href="/products/p/skiip-26mli07e3v1-m10-25232800m10">SKiiP 26MLI07E3V1-M10</a><a href="/products/p/skiip-26mli07e3v1-m11-25232800m11">SKiiP 26MLI07E3V1-M11</a><a href="/products/p/skiip-26mli07e3v1-m20-25232800m20">SKiiP 26MLI07E3V1-M20</a><a href="/products/p/skiip-26mli07e3v1-m21-25232800m21">SKiiP 26MLI07E3V1-M21</a><a href="/products/p/skiip-26mli07e3v1-m25-25232800m25">SKiiP 26MLI07E3V1-M25</a>
产品变体介绍The SKiiP 26MLI07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)