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25241223M25

SKiiP 26GB12F4V1-M25

MiniSKiiP II 2, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流200 A
电压1200 V
拓扑Half-Bridge
产品线MiniSKiiP
外壳MiniSKiiP II 2
尺寸59x52x16
技术IGBT
芯片技术IGBT 4 Fast (Trench)
特性Fast Trench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
变体Standard lid and HPTP

一般规格

特性
毛重0.06 千克
净重0.055 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip-26gb12f4v1-m20-25241223m20">SKiiP 26GB12F4V1-M20</a><a href="/products/p/skiip-26gb12f4v1-m25-25241223m25">SKiiP 26GB12F4V1-M25</a>
产品变体介绍The SKiiP 26GB12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)