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Semikron Danfoss Standard Photo MiniSKiiP II 2

25233680M25

SKiiP 25NAB12RAV1-M25

MiniSKiiP II 2, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地ChinaSlovakiaGermany
电流50 A
电压1200 V
拓扑CIB
产品线MiniSKiiP
外壳MiniSKiiP II 2
尺寸59x52x16
技术IGBT
芯片技术RGA
特性1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

一般规格

特性
毛重0.06 千克
净重0.055 千克

Variant information

特性
Variants<a href="/zh-cn/products/p/skiip-25nab12rav1-m01-25233680m01">SKiiP 25NAB12RAV1-M01</a><a href="/zh-cn/products/p/skiip-25nab12rav1-m05-25233680m05">SKiiP 25NAB12RAV1-M05</a><a href="/zh-cn/products/p/skiip-25nab12rav1-m15-25233680m15">SKiiP 25NAB12RAV1-M15</a><a href="/zh-cn/products/p/skiip-25nab12rav1-m20-25233680m20">SKiiP 25NAB12RAV1-M20</a><a href="/zh-cn/products/p/skiip-25nab12rav1-m25-25233680m25">SKiiP 25NAB12RAV1-M25</a>
产品变体介绍The SKiiP 25NAB12RAV1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
变体Standard lid and HPTP