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25233330M15

SKiiP 25AC12RAV1-M15

MiniSKiiP II 2, Slim lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流50 A
电压1200 V
拓扑Sixpack
产品线MiniSKiiP
外壳MiniSKiiP II 2
尺寸59x52x16
技术IGBT
芯片技术RGA
特性1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
变体Slim lid and HPTP

一般规格

特性
毛重0.07 千克
净重0.065 千克

Variant information

特性
Variants<a href="/products/p/skiip-25ac12rav1-m01-25233330m01">SKiiP 25AC12RAV1-M01</a><a href="/products/p/skiip-25ac12rav1-m15-25233330m15">SKiiP 25AC12RAV1-M15</a><a href="/products/p/skiip-25ac12rav1-m20-25233330m20">SKiiP 25AC12RAV1-M20</a><a href="/products/p/skiip-25ac12rav1-m25-25233330m25">SKiiP 25AC12RAV1-M25</a>
产品变体介绍The SKiiP 25AC12RAV1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)