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24921700VM05

SK75GD12T4ETE2-M05

SEMITOP E2, HPTP

产品规格

特性
产品状态In Production
原产地Italy
电流75 A
电压1200 V
拓扑Sixpack
产品线SEMITOP
外壳SEMITOP E2
尺寸63x57x12
技术IGBT
芯片技术IGBT 4 (Trench)
特性Optimized design for superior thermal performancesLow inductive designPress-Fit contact technology1200V Trench IGBT4 (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
典型应用Motor drivesServo drivesAir conditioningAuxiliary InvertersUPS
变体HPTP

一般规格

特性
毛重0.058 千克
净重0.038 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/sk75gd12t4ete2-m05-24921700vm05">SK75GD12T4ETE2-M05</a><a href="/products/p/sk75gd12t4ete2-m07-24921700vm07">SK75GD12T4ETE2-M07</a>
产品变体介绍The SK75GD12T4ETE2-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)