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24922910VM05

SK50DGDL12T7ETE2s-M05

SEMITOP E2 Solder, HPTP

产品规格

特性
产品状态In Production New
原产地Italy
电流50 A
电压1200 V
拓扑CIB
产品线SEMITOP
外壳SEMITOP E2 Solder
尺寸63x57x12
技术IGBT
芯片技术IGBT T7
特性Optimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
典型应用Motor drivesAir conditioningAuxiliary Inverters
变体HPTP

一般规格

特性
毛重0.055 千克
净重0.035 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/sk50dgdl12t7ete2s-m05-24922910vm05">SK50DGDL12T7ETE2s-M05</a><a href="/products/p/sk50dgdl12t7ete2s-m07-24922910vm07">SK50DGDL12T7ETE2s-M07</a>
产品变体介绍The SK50DGDL12T7ETE2s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)