24921130VM05
SK50DGDL066ETE2-M05
SEMITOP E2, HPTP
24921130VM05
产品规格
特性 | 值 |
|---|---|
| 产品状态 | Sample Status |
| 原产地 | Italy |
| 电流 | 50 A |
| 电压 | 600 V |
| 拓扑 | CIB |
| 产品线 | SEMITOP |
| 外壳 | SEMITOP E2 |
| 尺寸 | 63x57x12 |
| 技术 | IGBT |
| 芯片技术 | IGBT 3 (Trench) |
| 特性 | Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology600V Trench IGBT3 (066)Robust and soft switching CAL HD diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| 典型应用 | Motor drivesAir conditioningAuxiliary Inverters |
| 变体 | HPTP |
一般规格
特性 | 值 |
|---|---|
| 毛重 | 0.055 千克 |
| 净重 | 0.035 千克 |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
特性 | 值 |
|---|---|
| Variants | <a href="/products/p/sk50dgdl066ete2-m05-24921130vm05">SK50DGDL066ETE2-M05</a><a href="/products/p/sk50dgdl066ete2-m07-24921130vm07">SK50DGDL066ETE2-M07</a> |
| 产品变体介绍 | The SK50DGDL066ETE2-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| 产品变体简要介绍 | Module + High Performance Thermal Paste (HPTP) |