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24919781VM01

SK25DGD12T4Tp-M01

SEMITOP 4 Press-Fit, Wacker P12

产品规格

特性
产品状态In Production
原产地Italy
电流25 A
电压1200 V
拓扑CI
产品线SEMITOP
外壳SEMITOP 4 Press-Fit
尺寸61x55x12
技术IGBT
芯片技术IGBT 4 (Trench)
特性One screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrateTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
典型应用Motor drives
变体Wacker P12

一般规格

特性
毛重0.074 千克
净重0.06 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/sk25dgd12t4tp-m01-24919781vm01">SK25DGD12T4Tp-M01</a><a href="/products/p/sk25dgd12t4tp-m05-24919781vm05">SK25DGD12T4Tp-M05</a>
产品变体介绍The SK25DGD12T4Tp-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
产品变体简要介绍Module + Thermal Paste Wacker P12