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25232410M25

SKiiP03NEC066V3-M25

MiniSKiiP II 0, Standard lid and HPTP

製品仕様

特徴
TypeMiniSKiiP II 0
Variant DescriptionThe SKiiP03NEC066V3-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
チップ技術IGBT 3 (Trench)
トポロジーCI
ハウジングMiniSKiiP II 0
バリアントStandard lid and HPTP
代表的なアプリケーションInverter up to 5,6 kVATypical motor power 3,0 kW
原産国Germany
寸法34x31x16
技術IGBT
特徴Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
製品の状態In Production
製品ラインMiniSKiiP
電圧 (V)600 V
電流 (A)15 A

一般仕様

特徴
総重量0.023 Kilogram
正味重量0.02 Kilogram
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