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25241219M15

SKiiP 38GB12E4V1-M15

MiniSKiiP II 3, Slim lid and HPTP

Product specifications

Characteristic
Value
TypeMiniSKiiP II 3
Variant DescriptionThe SKiiP 38GB12E4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
チップ技術IGBT 4 (Trench)
トポロジーHalf-Bridge
ハウジングMiniSKiiP II 3
バリアントSlim lid and HPTP
原産国Germany
寸法82x59x16
技術IGBT
特徴Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
製品の状態In Production New
製品ラインMiniSKiiP
電圧 (V)1200 V
電流 (A)300 A

General specifications

Characteristic
Value
総重量0.1 Kilogram
正味重量0.082 Kilogram
Proposition 65Cancer and Reproductive Harm