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25240715M25

SKiiP 26GB07E3V1-M25

MiniSKiiP II 2, Standard lid and HPTP

Product specifications

Characteristic
Value
TypeMiniSKiiP II 2
Variant DescriptionThe SKiiP 26GB07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
チップ技術IGBT 3 (Trench)
トポロジーHalf-Bridge
ハウジングMiniSKiiP II 2
バリアントStandard lid and HPTP
原産国Germany
寸法59x52x16
技術IGBT
特徴650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
製品の状態In Production New
製品ラインMiniSKiiP
電圧 (V)650 V
電流 (A)200 A

General specifications

Characteristic
Value
総重量0.06 Kilogram
正味重量0.055 Kilogram
Proposition 65Cancer and Reproductive Harm