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24919781VM01

SK25DGD12T4Tp-M01

SEMITOP 4 Press-Fit, Wacker P12

製品仕様

特徴
チップ技術IGBT 4 (Trench)
トポロジーCI
ハウジングSEMITOP 4 Press-Fit
バリアントWacker P12
代表的なアプリケーションMotor drives
分類の簡単な説明Module + Thermal Paste Wacker P12
分類の説明The SK25DGD12T4Tp-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
原産国Italy
寸法61x55x12
技術IGBT
特徴One screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrateTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
製品の状態In Production
製品ラインSEMITOP
電圧 (V)1200 V
電流 (A)25 A

一般仕様

特徴
総重量0.074 Kilogram
正味重量0.06 Kilogram
Proposition 65Cancer and Reproductive Harm