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22894260VM05

SKM800GB12M7-M05

SEMITRANS 3, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandSlovakia
Stromstärke (A)800 A
Spannung1200 V
TopologieHalf-Bridge
ProduktlinieSEMITRANS
GehäuseSEMITRANS 3
Abmessungen (LxBxH)106x62x31
TechnologieIGBT
Chip TechnologieIGBT M7
EigenschaftenV<sub>CE(sat)</sub> with positive temperature coefficientFast and soft switching inverse CAL7 diodesHigh overload capabilityLow loss high density IGBT´sLarge clearance (10 mm) and creepage distances (20 mm)Insulated copper baseplate using DBC Technology (Direct Bonded Copper)UL recognized, file no. E63532
Typische AnwendungsgebieteAC inverter drivesUPSSolar energyEnergy storage

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.32 Kilogramm
Nettogewicht0.31 Kilogramm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SKM800GB12M7-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skm800gb12m7-m05-22894260vm05">SKM800GB12M7-M05</a><a href="/products/p/skm800gb12m7-m07-22894260vm07">SKM800GB12M7-M07</a><a href="/products/p/skm800gb12m7-22894260">SKM800GB12M7</a>