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Semikron Danfoss Standard Photo MiniSKiiP II 3

25232780M25

SKiiP 39TMLI12T4V2-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)200 A
Spannung1200 V
Topologie3-Level
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 39TMLI12T4V2-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-39tmli12t4v2-m00-25232780m00">SKiiP 39TMLI12T4V2-M00</a><a href="/de-de/products/p/skiip-39tmli12t4v2-m20-25232780m20">SKiiP 39TMLI12T4V2-M20</a><a href="/de-de/products/p/skiip-39tmli12t4v2-m21-25232780m21">SKiiP 39TMLI12T4V2-M21</a><a href="/de-de/products/p/skiip-39tmli12t4v2-m25-25232780m25">SKiiP 39TMLI12T4V2-M25</a>