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Semikron Danfoss Standard Photo MiniSKiiP II 3

25238000M11

SKiiP 39MLI07E3V1-M11

MiniSKiiP II 3, Slim lid and Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 3 (Trench)
Eigenschaften650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung650 V
Stromstärke (A)200 A
TechnologieIGBT
Topologie3-Level
TypMiniSKiiP II 3
Typische AnwendungsgebieteUninterruptible power supplies (UPS)Solar inverters
VarianteSlim lid and Wacker P12
Varianten BeschreibungThe SKiiP 39MLI07E3V1-M11 is a 650 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Slim Pressure Lid + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm