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25232770M01

SKiiP 39GA12T4V1-M01

MiniSKiiP II 3, Wacker P12

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandChinaGermany
Stromstärke (A)150 A
Spannung1200 V
TopologieSingle Switch
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 39GA12T4V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/de-de/products/p/skiip-39ga12t4v1-m00-25232770m00">SKiiP 39GA12T4V1-M00</a><a href="/de-de/products/p/skiip-39ga12t4v1-m01-25232770m01">SKiiP 39GA12T4V1-M01</a><a href="/de-de/products/p/skiip-39ga12t4v1-m20-25232770m20">SKiiP 39GA12T4V1-M20</a><a href="/de-de/products/p/skiip-39ga12t4v1-m21-25232770m21">SKiiP 39GA12T4V1-M21</a><a href="/de-de/products/p/skiip-39ga12t4v1-m25-25232770m25">SKiiP 39GA12T4V1-M25</a>