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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231000M25

SKiiP 39AC12T4V21-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532Insulated by Si3N4 (Silicon Nitride) AMB (Active Metal Brazed) ceramic substrate for optimized thermal performance
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)150 A
TechnologieIGBT
TopologieSixpack
TypeMiniSKiiP II 3
Typische AnwendungsgebieteInverter up to 50 kVATypical motor power 30 kW
Variant DescriptionThe SKiiP 39AC12T4V21-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
VarianteStandard lid and HPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm