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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231000M25

SKiiP 39AC12T4V21-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandChinaGermany
Stromstärke (A)150 A
Spannung1200 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532Insulated by Si3N4 (Silicon Nitride) AMB (Active Metal Brazed) ceramic substrate for optimized thermal performance
Typische AnwendungsgebieteInverter up to 50 kVATypical motor power 30 kW

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 39AC12T4V21-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-39ac12t4v21-m01-25231000m01">SKiiP 39AC12T4V21-M01</a><a href="/products/p/skiip-39ac12t4v21-m05-25231000m05">SKiiP 39AC12T4V21-M05</a><a href="/products/p/skiip-39ac12t4v21-m15-25231000m15">SKiiP 39AC12T4V21-M15</a><a href="/products/p/skiip-39ac12t4v21-m20-25231000m20">SKiiP 39AC12T4V21-M20</a><a href="/products/p/skiip-39ac12t4v21-m25-25231000m25">SKiiP 39AC12T4V21-M25</a>