25231360M25
SKiiP 39AC066V4-M25
MiniSKiiP II 3, Standard lid and HPTP
25231360M25
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 82x59x16 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532 |
| Gehäuse | MiniSKiiP II 3 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 600 V |
| Stromstärke (A) | 150 A |
| Technologie | IGBT |
| Topologie | Sixpack |
| Type | MiniSKiiP II 3 |
| Variant Description | The SKiiP 39AC066V4-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Variante | Standard lid and HPTP |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.1 Kilogramm |
| Nettogewicht | 0.082 Kilogramm |
| Vorschlag 65 | Cancer and Reproductive Harm |