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Semikron Danfoss Standard Photo MiniSKiiP II 3

25233300M01

SKiiP 38NAB12RAV1-M01

MiniSKiiP II 3, Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandSlovakiaGermany
Stromstärke (A)100 A
Spannung1200 V
TopologieCIB
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieRGA
Eigenschaften1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 38NAB12RAV1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/de-de/products/p/skiip-38nab12rav1-m01-25233300m01">SKiiP 38NAB12RAV1-M01</a><a href="/de-de/products/p/skiip-38nab12rav1-m15-25233300m15">SKiiP 38NAB12RAV1-M15</a><a href="/de-de/products/p/skiip-38nab12rav1-m20-25233300m20">SKiiP 38NAB12RAV1-M20</a><a href="/de-de/products/p/skiip-38nab12rav1-m25-25233300m25">SKiiP 38NAB12RAV1-M25</a>