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Semikron Danfoss Standard Photo MiniSKiiP II 3

25240719M25

SKiiP 38GB07E3V1-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)300 A
Spannung650 V
TopologieHalf-Bridge
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
Eigenschaften650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 38GB07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-38gb07e3v1-m00-25240719m00">SKiiP 38GB07E3V1-M00</a><a href="/de-de/products/p/skiip-38gb07e3v1-m01-25240719m01">SKiiP 38GB07E3V1-M01</a><a href="/de-de/products/p/skiip-38gb07e3v1-m10-25240719m10">SKiiP 38GB07E3V1-M10</a><a href="/de-de/products/p/skiip-38gb07e3v1-m11-25240719m11">SKiiP 38GB07E3V1-M11</a><a href="/de-de/products/p/skiip-38gb07e3v1-m20-25240719m20">SKiiP 38GB07E3V1-M20</a><a href="/de-de/products/p/skiip-38gb07e3v1-m21-25240719m21">SKiiP 38GB07E3V1-M21</a><a href="/de-de/products/p/skiip-38gb07e3v1-m25-25240719m25">SKiiP 38GB07E3V1-M25</a>