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25240719M00

SKiiP 38GB07E3V1-M00

MiniSKiiP II 3, No accessory

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 3 (Trench)
Eigenschaften650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung650 V
Stromstärke (A)300 A
TechnologieIGBT
TopologieHalf-Bridge
TypMiniSKiiP II 3
VarianteNo accessory
Varianten BeschreibungThe SKiiP 38GB07E3V1-M00 is a 650 V IGBT module and comes as bare module without pre-applied thermal paste or lid ideal for custom assembly processes.
Varianten KurzbeschreibungBare module without pre-applied TIM or lid

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm