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25230640M11

SKiiP 37NAB066V1-M11

MiniSKiiP II 3, Slim lid and Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)75 A
TechnologieIGBT
TopologieCIB
TypeMiniSKiiP II 3
Typische AnwendungsgebieteInverter up to 18 kVATypical motor power 7,5 kW
Variant DescriptionThe SKiiP 37NAB066V1-M11 is a 600 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness.
Variant Short DescriptionModule + Slim Pressure Lid + Thermal Paste Wacker P12
VarianteSlim lid and Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm