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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231050M25

SKiiP 35NAC12F4V1-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsRobust and soft switching diodes in CAL technologyNEW SKR PEP diode-technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)50 A
TechnologieIGBT
TopologieCI
TypeMiniSKiiP II 3
VarianteStandard lid and HPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Vorschlag 65Cancer and Reproductive Harm