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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231050M25

SKiiP 35NAC12F4V1-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandChinaGermany
Stromstärke (A)50 A
Spannung1200 V
TopologieCI
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsRobust and soft switching diodes in CAL technologyNEW SKR PEP diode-technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 35NAC12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-35nac12f4v1-m01-25231050m01">SKiiP 35NAC12F4V1-M01</a><a href="/products/p/skiip-35nac12f4v1-m20-25231050m20">SKiiP 35NAC12F4V1-M20</a><a href="/products/p/skiip-35nac12f4v1-m25-25231050m25">SKiiP 35NAC12F4V1-M25</a>