25231740M01
SKiiP 35ACC12F4V1-M01
MiniSKiiP II 3, Wacker P12
25231740M01
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 82x59x16 |
| Chip Technologie | IGBT 4 Fast (Trench) |
| Eigenschaften | Fast Trench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Gehäuse | MiniSKiiP II 3 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production New |
| Spannung | 1200 V |
| Stromstärke (A) | 50 A |
| Technologie | IGBT |
| Topologie | Twelvepack |
| Type | MiniSKiiP II 3 |
| Variant Description | The SKiiP 35ACC12F4V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Variant Short Description | Module + Thermal Paste Wacker P12 |
| Variante | Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.1 Kilogramm |
| Nettogewicht | 0.082 Kilogramm |
| Vorschlag 65 | Cancer and Reproductive Harm |