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25232830M21

SKiiP 29TMLI12F4V1-M21

MiniSKiiP II 2, Standard lid and Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT 4 Fast (Trench)
EigenschaftenFast Trench 4 IGBTsTrench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)150 A
TechnologieIGBT
Topologie3-Level
TypeMiniSKiiP II 2
Variant DescriptionThe SKiiP 29TMLI12F4V1-M21 is a 1200 V IGBT module and comes with a standard 6.5mm height lid and pre-applied silicone-based thermal paste Wacker P12 (λ=0.8 W/mK).
Variant Short DescriptionModule + Standard Pressure Lid + Thermal Paste Wacker P12
VarianteStandard lid and Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Vorschlag 65Cancer and Reproductive Harm