25231350M01
SKiiP 28ANB16V10-M01
MiniSKiiP II 2, Wacker P12
25231350M01
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 59x52x16 |
| Eigenschaften | Fast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532UL recognised temperature sensor: file no. E257829 |
| Gehäuse | MiniSKiiP II 2 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 1600 V |
| Stoßstrom (A) | 1000 A |
| Stromstärke (A) | 83 A |
| Technologie | Bridge |
| Topologie | Rectifier |
| Typ | MiniSKiiP II 2 |
| Variante | Wacker P12 |
| Varianten Beschreibung | The SKiiP 28ANB16V10-M01 is a 1600 V Bridge module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness |
| Varianten Kurzbeschreibung | Module + Thermal Paste Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.06 Kilogramm |
| Nettogewicht | 0.055 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |