Semikron Danfoss logo

25230160M05

SKiiP 28ANB16V1-M05

MiniSKiiP II 2, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
EigenschaftenFast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1600 V
Stoßstrom (A)1000 A
Stromstärke (A)83 A
TechnologieBridge
TopologieRectifier
TypMiniSKiiP II 2
Typische AnwendungsgebieteInput bridge for Inverter up to 39 kVA
VarianteHPTP
Varianten BeschreibungThe SKiiP 28ANB16V1-M05 is a 1600 V Bridge module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Proposition 65Cancer and Reproductive Harm