Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 2

25230170M25

SKiiP 28AHB16V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
EigenschaftenFast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1600 V
Stoßstrom (A)1000 A
Stromstärke (A)82 A
TechnologieBridge
TopologieRectifier
TypeMiniSKiiP II 2
Typische AnwendungsgebieteInput bridge for inverter up to 39 kVA
Variant DescriptionThe SKiiP 28AHB16V1-M25 is a 1600 V Bridge module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
VarianteStandard lid and HPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Vorschlag 65Cancer and Reproductive Harm