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Semikron Danfoss Standard Photo MiniSKiiP II 2

25230620M15

SKiiP 25NAB066V1-M15

MiniSKiiP II 2, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)30 A
TechnologieIGBT
TopologieCIB
TypeMiniSKiiP II 2
Typische AnwendungsgebieteInverter up to 10 kVATypical motor power 4,0 kW
Variant DescriptionThe SKiiP 25NAB066V1-M15 is a 600 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
VarianteSlim lid and HPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm
Vorschlag 65Cancer and Reproductive Harm