Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 2

25233700M25

SKiiP 23NAB12RAV1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandSlovakiaGermany
Stromstärke (A)25 A
Spannung1200 V
TopologieCIB
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 2
Abmessungen (LxBxH)59x52x16
TechnologieIGBT
Chip TechnologieRGA
Eigenschaften1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.06 Kilogramm
Nettogewicht0.055 Kilogramm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 23NAB12RAV1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-23nab12rav1-m01-25233700m01">SKiiP 23NAB12RAV1-M01</a><a href="/de-de/products/p/skiip-23nab12rav1-m20-25233700m20">SKiiP 23NAB12RAV1-M20</a><a href="/de-de/products/p/skiip-23nab12rav1-m25-25233700m25">SKiiP 23NAB12RAV1-M25</a>