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Semikron Danfoss Standard Photo MiniSKiiP II 2

25233200M25

SKiiP 22ACC12T7V20-M25

MiniSKiiP II 2, Standard lid and HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)59x52x16
Chip TechnologieIGBT T7
Eigenschaften1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor
GehäuseMiniSKiiP II 2
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)15 A
TechnologieIGBT
TopologieTwelvepack
TypeMiniSKiiP II 2
Variant DescriptionThe SKiiP 22ACC12T7V20-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
VarianteStandard lid and HPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.655 Kilogramm
Nettogewicht0.65 Kilogramm
Vorschlag 65Cancer and Reproductive Harm