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Semikron Danfoss Standard Photo MiniSKiiP II 1

25233600M01

SKiiP 13AC12RAV1-M01

MiniSKiiP II 1, Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)25 A
Spannung1200 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 1
Abmessungen (LxBxH)42x40x16
TechnologieIGBT
Chip TechnologieRGA
Eigenschaften1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
VarianteWacker P12
Varianten BeschreibungThe SKiiP 13AC12RAV1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-13ac12rav1-m01-25233600m01">SKiiP 13AC12RAV1-M01</a><a href="/products/p/skiip-13ac12rav1-m20-25233600m20">SKiiP 13AC12RAV1-M20</a><a href="/products/p/skiip-13ac12rav1-m25-25233600m25">SKiiP 13AC12RAV1-M25</a>

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm