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25231590M11

SKiiP 12AC12T4V1-M11

MiniSKiiP II 1, Slim lid and Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)42x40x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 1
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)15 A
TechnologieIGBT
TopologieSixpack
TypeMiniSKiiP II 1
Typische AnwendungsgebieteInverter up to 12 kVATypical motor power 5,5 kW
Variant DescriptionThe SKiiP 12AC12T4V1-M11 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness.
Variant Short DescriptionModule + Slim Pressure Lid + Thermal Paste Wacker P12
VarianteSlim lid and Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm