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Semikron Danfoss Standard Photo MiniSKiiP II 1

25230040M15

SKiiP 12AC126V1-M15

MiniSKiiP II 1, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)42x40x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenFast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 1
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)15 A
TechnologieIGBT
TopologieSixpack
TypeMiniSKiiP II 1
Typische AnwendungsgebieteInverter up to 10 kVATypical motor power 5.5 kW
Variant DescriptionThe SKiiP 12AC126V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
VarianteSlim lid and HPTP

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm