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Semikron Danfoss Standard Photo MiniSKiiP II 1

25230040M01

SKiiP 12AC126V1-M01

MiniSKiiP II 1, Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)42x40x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenFast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 1
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)15 A
TechnologieIGBT
TopologieSixpack
TypMiniSKiiP II 1
Typische AnwendungsgebieteInverter up to 10 kVATypical motor power 5.5 kW
VarianteWacker P12
Varianten BeschreibungThe SKiiP 12AC126V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm