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Semikron Danfoss Standard Photo MiniSKiiP II 1

25231880M01

SKiiP 11AC12T7V1-M01

MiniSKiiP II 1, Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)10 A
Spannung1200 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 1
Abmessungen (LxBxH)42x40x16
TechnologieIGBT
Chip TechnologieIGBT T7
Eigenschaften1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteWacker P12
Varianten BeschreibungThe SKiiP 11AC12T7V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12
Variants<a href="/de-de/products/p/skiip-11ac12t7v1-m01-25231880m01">SKiiP 11AC12T7V1-M01</a><a href="/de-de/products/p/skiip-11ac12t7v1-m15-25231880m15">SKiiP 11AC12T7V1-M15</a><a href="/de-de/products/p/skiip-11ac12t7v1-m20-25231880m20">SKiiP 11AC12T7V1-M20</a><a href="/de-de/products/p/skiip-11ac12t7v1-m25-25231880m25">SKiiP 11AC12T7V1-M25</a>