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25231610M21

SKiiP 11AC12T4V1-M21

MiniSKiiP II 1, Standard lid and Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)42x40x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
GehäuseMiniSKiiP II 1
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)8 A
TechnologieIGBT
TopologieSixpack
TypeMiniSKiiP II 1
Typische AnwendungsgebieteInverter up to 8 kVATypical motor power 4 kW
Variant DescriptionThe SKiiP 11AC12T4V1-M21 is a 1200 V IGBT module and comes with a standard 6.5mm height lid and pre-applied silicone-based thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Variant Short DescriptionModule + Standard Pressure Lid + Thermal Paste Wacker P12
VarianteStandard lid and Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.04 Kilogramm
Nettogewicht0.03 Kilogramm
Proposition 65Cancer and Reproductive Harm