25230900M11
SKiiP 11AC126V10-M11
MiniSKiiP II 1, Slim lid and Wacker P12
25230900M11
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 42x40x16 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Fast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532 |
| Gehäuse | MiniSKiiP II 1 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 6 A |
| Technologie | IGBT |
| Topologie | Sixpack |
| Type | MiniSKiiP II 1 |
| Variant Description | The SKiiP 11AC126V10-M11 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Variant Short Description | Module + Slim Pressure Lid + Thermal Paste Wacker P12 |
| Variante | Slim lid and Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.04 Kilogramm |
| Nettogewicht | 0.03 Kilogramm |
| Vorschlag 65 | Cancer and Reproductive Harm |