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25232360M01

SKiiP 03NEB066V3-M01

MiniSKiiP II 0, Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)34x31x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 0
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)15 A
TechnologieIGBT
TopologieCIB
TypeMiniSKiiP II 0
Typische AnwendungsgebieteInverter up to 5,6 kVATypical motor power 3,0 kW
Variant DescriptionThe SKiiP 03NEB066V3-M01 is a 600 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Variant Short DescriptionModule + Thermal Paste Wacker P12
VarianteWacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.023 Kilogramm
Nettogewicht0.02 Kilogramm
Vorschlag 65Cancer and Reproductive Harm