25230870M01
SKiiP 03NAC126V1-M01
MiniSKiiP II 0, Wacker P12
25230870M01
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 34x31x16 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Fast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532 |
| Gehäuse | MiniSKiiP II 0 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 8 A |
| Technologie | IGBT |
| Topologie | CI |
| Typ | MiniSKiiP II 0 |
| Variante | Wacker P12 |
| Varianten Beschreibung | The SKiiP 03NAC126V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness |
| Varianten Kurzbeschreibung | Module + Thermal Paste Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.023 Kilogramm |
| Nettogewicht | 0.02 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |