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Semikron Danfoss Standard Photo MiniSKiiP II 0

25232310M25

SKiiP 02NEC066V3-M25

MiniSKiiP II 0, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)34x31x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 0
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)10 A
TechnologieIGBT
TopologieCI
TypMiniSKiiP II 0
Typische AnwendungsgebieteInverter up to 5 kVATypical motor power 2,2 kW
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 02NEC066V3-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.023 Kilogramm
Nettogewicht0.02 Kilogramm
Proposition 65Cancer and Reproductive Harm