25232530M25
SKiiP 02NAC12T4V1-M25
MiniSKiiP II 0, Standard lid and HPTP
25232530M25
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 34x31x16 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Gehäuse | MiniSKiiP II 0 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production |
| Spannung | 1200 V |
| Stromstärke (A) | 4 A |
| Technologie | IGBT |
| Topologie | CI |
| Type | MiniSKiiP II 0 |
| Variant Description | The SKiiP 02NAC12T4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Variante | Standard lid and HPTP |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.023 Kilogramm |
| Nettogewicht | 0.02 Kilogramm |
| Vorschlag 65 | Cancer and Reproductive Harm |