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Semikron Danfoss Standard Photo MiniSKiiP II 0

25232340M25

SKiiP 01NAC066V3-M25

MiniSKiiP II 0, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)34x31x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 0
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)6 A
TechnologieIGBT
TopologieCI
TypMiniSKiiP II 0
Typische AnwendungsgebieteInverter up to 3,5 kVATypical motor power 1,5 kW
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 01NAC066V3-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.025 Kilogramm
Nettogewicht0.022 Kilogramm
Proposition 65Cancer and Reproductive Harm